Toshiba Semiconductor Bedienungsanleitung

[6] Handling Guide 93 [ 6 ] Handling Guide 1. Using Toshiba Semiconductors Safely TOSHIBA is continually working to improve the quality and re

[6] Handling Guide 102 3.3.7 Effect of Slow Rise and Fall Time on Input When a waveform with a slow rise and fall time is applied to a CMOS input,

[6] Handling Guide 103 3.3.10 Wiring Precautions (1) Output waveform distortion Since the output impedances of the Mini-MOS Series are very low, di

[6] Handling Guide 104 3.3.11 Latch-up CMOS devices are subject to latch-up, an undesirable condition in which a parasitic PNPN junction (thyristor)

[6] Handling Guide 105 Table 3.1 Test Result EIAJ Method MIL-STD Method Name Input Output Input Output TC7MH244FK >±200 V >±200 V &

[6] Handling Guide 106 3.3.13 Meta-Stable Characteristics When the setup time or hold-time of a flip-flop is not adhered to the device’s output resp

[6] Handling Guide 107 3.3.14 Thermal Design The failure rate of semiconductor devices is greatly increased as operating temperatures increase. As s

[6] Handling Guide 108 3.3.16 External Noise Printed circuit boards with long I/O or signal pattern lines are vulnerable to induced noise or surge

[6] Handling Guide 109 3.3.19 Safety Standards Each country has safety standards which must be observed. These safety standards include requirement

[6] Handling Guide 110 3.4.2 Inspection Sequence 1. Do not insert devices in the wrong orientation. Make sure that the positive and negative electr

[6] Handling Guide 111 on the internal leads. If the relative difference is great enough, the device’s internal leads, adhesive properties or seala

[6] Handling Guide 94 2. Safety Precautions This section lists important precautions which users of semiconductor devices (and anyone else) should

[6] Handling Guide 112 3.5.3 Soldering Temperature Profile The soldering temperature and heating time vary from device to device. Therefore, when s

[6] Handling Guide 113 3.5.4 Flux Cleaning and Ultrasonic Cleaning (1) When cleaning circuit boards to remove flux, make sure that no residual re

[6] Handling Guide 114 3.5.5 No Cleaning If analog devices or high-speed devices are used without being cleaned, flux residues may cause minute amou

[6] Handling Guide 115 3.6 Protecting Devices in the Field 3.6.1 Temperature Semiconductor devices are generally more sensitive to temperature tha

[6] Handling Guide 116 3.6.6 Interference from Light (ultraviolet rays, sunlight, fluorescent lamps and incandescent lamps) Light striking a semico

[6] Handling Guide 95 2.1 General Precautions regarding Semiconductor Devices Do not use devices under conditions exceeding their absolute maximu

[6] Handling Guide 96 3. General Safety Precautions and Usage Considerations This section is designed to help you gain a better understanding of s

[6] Handling Guide 97 (e) Make sure that sections of the tape carrier which come into contact with installation devices or other electrical machine

[6] Handling Guide 98 • When storing printed circuit boards which have devices mounted on them, use a board container or bag that is protected aga

[6] Handling Guide 99 3.2 Storage 3.2.1 General Storage • Avoid storage locations where devices will be exposed to moisture or direct sunlight •

[6] Handling Guide 100 3.3 Design Care must be exercised in the design of electronic equipment to achieve the desired reliability. It is important n

[6] Handling Guide 101 3.3.4 Input processing Inputs to CMOS ICs have such a high impedance that the logic level becomes undefined under open input